1.        University graduate from mechanical, automation, or electronic department.

2.        Minimum 5 years experience in the SMT field or Wire bond/Die Bond area. Familiar with maintenance and troubleshooting of equipment. Strong knowledge in either SMT or wire bond/die bond fabrication process especially Assembly process or SMT operations.

3.        Strong Knowledge in Panasonic chip shooter and BTU Reflow Oven or Wire Bond/Die bond, Know Asymtek dispenser, Laser Marker are preferred.

4.        Familiar with basic process control techniques e.g. SPC, DOE and FMEA.

5.        Strong English skill both on writing and speaking.

6.        Willing to be on-call 24*7.

7.        Some Travel to USA is required.